|
|
|
2024
|
| |
- Shenzhen Specialized and Specia₩↕lized New Enterprises
|
- Shenzhen Longgang District High Den₽✘₩sity Flip Chip Sealing Engiδ≈₩δneering Technology R&D Center
|
|
|
|
2023
|
| |
- Guangdong Integrated Circ 'uit Advanced Packaging Engin∞eering and Technology Re↑₹search Center
|
- Shenzhen Wafer Level Packagσ♠£ing (WLP) Engineering Researc≠Ω∑§h Center
|
- Guangdong Famous High-tec₽λ h Products-Large size h←Ω₽igh-end medical imaging CT detector
|
- Guangdong Famous Hi-Tech Pε roducts - Miniature Mγεodular Power Supply £♣with 3D Stacking Process for 5G₽•↑ and Other Applications
|
- Shenzhen Semiconductor Associat ™ion “Market Perform&×ance Award”.
|
- Shenzhen Semiconductor Associ™≥®Ωation “Industry-Education β≥Integration Award”.
|
- Guangdong Integrated Circuit Adva£Ω'∞nced Packaging Engineering an♣σ♦ d Technology Research Center
|
- Major Projects in Shenzhen, ✔®§≠2022-2023
|
|
|
|
2022
|
| |
- National High-tech Enterpr'φises
|
- Shenzhen Semiconductor Association€÷ “Innovative New Talent Awardγγ”.
|
- Guangdong Province “Sγ↕pecialized, Specialized an"÷←d New Enterprises&rdquo♥;
|
|
|
|
2021
|
| |
- Received "Guangdong Provin♥'↕♦cial Little giants"
|
|
|
|
2019
|
| |
- "Gazelle enterprise" in South ≠δαof Jiangsu
|
- Accredited as "Enterpri©δ±γse Technical Center" in φ∑☆δWuxi
|
|
|
|
|
|
2018
|
| |
- "Innovation and Entrepreneεδ↓↔urship Award" in Wuxi'₹ New Dirstrict
|
|
|
|
2016
|
| |
- "National High-tech Enterpri•σδses" approved for the first time
|
|
|
